Electroless Tin Plating liquid. 105 mL

Product Overview
Electroless Tin Plating Liquid (105 mL Plastic Bottle) is a self-contained, lead-free chemical solution designed for depositing uniform tin coatings on copper, brass, and nickel surfaces without external electrical power. Ideal for PCB edge connectors, semiconductor components, and electronic terminals, this formulation ensures excellent solderability, corrosion resistance, and RoHS compliance. Its user-friendly, ready-to-use design makes it perfect for small-scale labs, prototyping, and repair workflows.

Key Features

• RoHS-Compliant: Lead-free formulation meets global environmental standards.
• Uniform Deposition: Achieves 0.5–1.0 µm thickness in 10–20 minutes.
• No External Power: Electroless process simplifies plating without complex equipment.
• Extended Bath Life: Stable for 8–10 cycles under controlled conditions.
• Easy Application: Ready-to-use liquid for dip or brush plating.
• Corrosion Resistance: Protects surfaces from oxidation and tarnishing.
• Compact Packaging: 105 mL HDPE bottle with leak-proof seal.

Technical Specifications

• Chemical Composition: Proprietary tin-based reducing agents, stabilizers, and accelerators.
• pH: 4.5–5.5 (adjusted for optimal deposition)
• Operating Temperature: 50–70°C (122–158°F)
• Plating Rate: 0.5–1.0 µm/10 min
• Density: 1.10–1.25 g/cm³
• Shelf Life: 12 months in unopened bottle at 15–25°C

Benefits

• Enhanced Solderability: Smooth, pore-free tin layer improves soldering performance.
• Cost-Efficient: Minimal waste with precise 105 mL packaging.
• Time-Saving: Simplified process reduces setup and cleanup time.
• Versatile: Compatible with manual or small-tank immersion plating.
• Eco-Friendly: Low toxicity and biodegradable additives.

Usage Instructions

1. Surface Prep: Clean substrate with degreaser; rinse with deionized water.
2. Activation: Immerse in 5–10% sulfuric acid for 1–2 minutes; rinse again.
3. Plating: Submerge part in liquid for 10–20 minutes at 50–70°C (agitate gently).
4. Rinsing: Rinse thoroughly with deionized water; dry with compressed air.
5. Disposal: Neutralize spent solution with baking soda before disposal.

Safety & Storage

• Handling: Wear nitrile gloves, goggles, and lab coat; avoid inhalation.
• Storage: Keep bottle tightly sealed in a cool, dark place (15–25°C).
• Incompatibilities: Do not mix with acids, bases, or oxidizers.
• First Aid: Flush skin/eyes with water for 15 minutes; seek medical attention if needed.

Applications

• PCB edge connectors and contacts
• Semiconductor lead frames and terminals
• Electrical connectors and relays
• Jewelry and decorative tin plating
• R&D and prototype coating projects

Why Choose This Plating Liquid?
This 105 mL Electroless Tin Plating Liquid offers a compact, efficient solution for high-quality tin deposition in low-volume applications. Its RoHS compliance, ease of use, and reliable performance make it indispensable for engineers and technicians seeking durable, solder-ready coatings without complex infrastructure.