MECHANIC Solder Paste Soldering Tin Cream for PCB 42gm XG-50

The MECHANIC XG-50 Solder Paste (42g) is a high-performance, leaded solder paste designed for precision electronics work. Its eutectic alloy composition ensures reliable soldering results, making it suitable for tasks such as BGA rework, SMD soldering, and PCB repairs.

🔧 Key Features

• Eutectic Alloy Composition (Sn63/Pb37)
  Provides a sharp melting point at 183°C, ensuring consistent and reliable solder joints.

• Fine Particle Size (25–45μm)
  Ensures smooth application and optimal wetting, ideal for fine-pitch components and intricate soldering tasks.

• No-Clean Formula
  Leaves minimal residue, eliminating the need for post-soldering cleaning and reducing the risk of corrosion.

• Low Viscosity
  Facilitates easy application, whether using a stencil, syringe, or manual methods.

• Stable Performance
  Maintains consistent soldering quality over time when stored properly.

📐 Specifications

• Model: XG-50

• Weight: 42 grams

• Alloy Composition: Sn63/Pb37

• Melting Point: 183°C

• Particle Size: 25–45μm

• Flux Type: No-clean

• Shelf Life: Up to 6 months when sealed; store in a cool, dry place

🛠️ Applications

• BGA Rework and Reballing: Ideal for ball grid array component repairs.

• SMD Soldering: Suitable for surface-mount device soldering tasks.

• PCB Repairs: Effective for printed circuit board maintenance and modifications.

• Mobile Device Repairs: Commonly used in smartphone and tablet soldering applications.

The MECHANIC XG-50 Solder Paste offers reliable pe