Metallic Solder Paste 15g for PCB/SMD/BGA/PGA

Metallic Solder Paste 15g for PCB/SMD/BGA/PGA

Solder Paste (Mixture of tin alloy powder & paste flux) for repairing electronic boards, PCs, Laptops, Smartphones, playstation, Satellite Receiver and all sensitive electronic appliances by using tin soldering iron, hot air soldering station and SMT/BGA rework station.

Specification:

• Particle Size:30-45 Micron.

• Alloy: Sn63/Pb37.

• Melting Point: 185-240 Celsius.

Features:

• Suitable to stencil printing (holes larger than 0.45mm).

• Good conductivity and oxidation resistance.

• High purity, stable viscosity and soft soldering.

• Bright and full solder joints.

• No residue solid after rework and easy cleaning.

• Halogen free.

• 65% Metal Content.

Usage:

• Repairing electronic boards such as PCB/SMD/BGA/PGA for PCs, Laptops, Smartphones, playstation, Satellite Receiver and all sensitive electronic appliances.

• Reballing BGA chipset with reballing stencil (holes larger than 0.45mm).

• Repairing phones, as well as replacement SMD component, micro switches and charging connectors.

• Soldering electrical control boards.

• Soldering all copper alloys, wires, lithium ion batteries and solderable surfaces as nickel strips.

Usage Recommendations (very important):

• Follow safety precautions & notes.

• Clean the surface (Clear any residues or dust).

• Put a very little bit of solder paste before soldering.

• Use a suitable soldering iron tip with the target area.

• Use a suitable soldering iron with the target size.

• Use a suitable soldering station with the target component.

• Use a wet soldering sponge for cleaning the tip and during soldering.

• Use thinner or any alcohol for cleaning.

Notes:

• For best results, follow the usage recommendations.

• Don’t put soldering iron tip in the solder paste.

• Not suitable with welding by fusion or flame.

Safety Precautions:

• Close after using & keep away from children.

• Use enough water when eyes or wounds are touched.

Appearance:

The solder paste is a soft paste, packaged in a round plastic can – net weight 15g.

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