Photoresist Stripper Solution 422-5 (500ml)

Product Overview
Photoresist Stripper Solution 422-5 (500 mL) is a high-efficiency, ready-to-use chemical formulation designed for fast and complete removal of positive and negative photoresists in PCB fabrication, semiconductor manufacturing, and microelectronics R&D. This non-flammable, alkaline-based solution ensures safe and residue-free stripping while protecting sensitive substrates like copper, gold, and aluminum. Ideal for immersion, spray, or manual processing, it streamlines workflows in both laboratory and production environments.

Key Features

• Broad Compatibility: Effective on positive/negative-acting photoresists, including dry films and liquid resists.
• Fast Stripping: Removes photoresist layers in 2–5 minutes (varies by resist type and thickness).
• Substrate-Safe: Non-corrosive to metals (Cu, Au, Al) and dielectric materials.
• Low VOC Formula: Environmentally friendly with reduced volatile organic compounds.
• Ready-to-Use: No dilution required; optimized for direct application.
• Extended Shelf Life: Stable for 24 months when stored in sealed containers at 15–25°C.
• Compliance: Meets RoHS and REACH standards for industrial safety.

Technical Specifications

• Active Ingredients: Alkaline-based proprietary blend
• pH: 11.5–12.5
• Density: 1.05–1.15 g/cm³
• Operating Temperature: 20–40°C (optimal performance at 25°C)
• Packaging: 500 mL HDPE bottle with chemical-resistant seal.

Benefits

• High Efficiency: Rapid stripping reduces production downtime.
• Cost-Effective: Low consumption rate minimizes operational costs.
• Versatile Application: Compatible with immersion tanks, spray tools, or brush techniques.
• Eco-Friendly: Biodegradable components and low toxicity enhance workplace safety.
• Residue-Free: Leaves substrates clean for subsequent etching or plating steps.

Usage Instructions

1. Preparation: Wear PPE (gloves, goggles, lab coat). Ensure adequate ventilation.
2. Application:
   • Immersion: Submerge substrate in Solution 422-5 for 2–5 minutes.
   • Spray: Apply at 20–30 psi; adjust dwell time based on resist thickness.
3. Agitation: Gently agitate solution or substrate to enhance stripping.
4. Rinsing: Rinse thoroughly with deionized water after stripping.
5. Disposal: Neutralize spent solution per local regulations before disposal.

Safety & Storage

• Handling: Avoid skin/eye contact; use in fume hood or well-ventilated area.
• Storage: Keep bottle tightly sealed in a cool, dry place (15–25°C).
• Incompatibilities: Do not mix with acids or oxidizing agents.
• First Aid: Flush exposed skin/eyes with water for 15 minutes; seek medical help if irritated.

Applications

• PCB photoresist stripping post-etching or plating
• Semiconductor wafer cleaning
• MEMS and micro-optics fabrication
• R&D labs for photolithography processes
• Repair and rework of coated substrates

Why Choose Solution 422-5?
Photoresist Stripper Solution 422-5 combines rapid performance, material compatibility, and environmental responsibility, making it a top choice for precision stripping in critical electronics manufacturing. Its ready-to-use formula, extended shelf life, and compliance with global safety standards ensure consistent results for prototyping, small-scale labs, and high-volume production lines.