مساعد لحام معدني ميكانيك 42 جرام لـ PCB موديل: XG-50

The MECHANIC XG-50 Solder Paste (42g) is a high-performance, leaded solder paste designed for precision electronics work.Its eutectic alloy composition ensures reliable soldering results, making it suitable for tasks such as BGA rework, SMD soldering, and PCB repairs.

🔧 Key Features

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  Eutectic Alloy Composition (Sn63/Pb37)
  Provides a sharp melting point at 183°C, ensuring consistent and reliable solder joints.

  
  


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  Fine Particle Size (25–45μm)
  Ensures smooth application and optimal wetting, ideal for fine-pitch components and intricate soldering tasks.

  
  


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  No-Clean Formula
  Leaves minimal residue, eliminating the need for post-soldering cleaning and reducing the risk of corrosion.

  
  


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  Low Viscosity
  Facilitates easy application, whether using a stencil, syringe, or manual methods.

  
  


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  Stable Performance
  Maintains consistent soldering quality over time when stored properly.

  
  

📐 Specifications

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  Model: XG-50

  
  


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  Weight: 42 grams

  
  


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  Alloy Composition: Sn63/Pb37

  
  


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  Melting Point: 183°C

  
  


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  Particle Size: 25–45μm

  
  


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  Flux Type: No-clean

  
  


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  Shelf Life: Up to 6 months when sealed; store in a cool, dry place

  
  

🛠️ Applications

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  BGA Rework and Reballing: Ideal for ball grid array component repairs.

  
  


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  SMD Soldering: Suitable for surface-mount device soldering tasks.

  
  


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  PCB Repairs: Effective for printed circuit board maintenance and modifications.

  
  


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  Mobile Device Repairs: Commonly used in smartphone and tablet soldering applications.

  
  

The MECHANIC XG-50 Solder Paste offers reliable pe